產品展示
TP100 Latent Hardener for Epoxy Resins
Description
Latent Hardener for Epoxy Resins TP100 is a micronized grade of dicyandiamide which finds application as latent hardener for the hot curing epoxy resins.
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Technical Parameters
Assay of Dicyandiamide (%) |
＞97.3 |
Content of Water (%) |
＜ 0.30 |
Content of Anti Caking Agent (%) |
＜ 1.60 |
Melting Point (℃) |
209 - 212 |
Dicyandiamide |
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Particle size 98% |
＜40 |
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Typical Values
Appearance |
White Powder |
Assay of Dicyandiamide（%） |
98.1 |
Content of Water （%） |
0.2 |
Content of Anti Caking Agent （%） |
1.5 |
Melting Point of（℃） |
210 |
Sum of Organic Impurities （%） |
0.2 |
Particle Size 98% |
30 - 35 |
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Package & Storage & Handling
1. Bag containing 15 kg net (600 kg per pallet).
2. Unlimited storability in a dry place at ambient temperature without chemical decomposition. Long storage may result in caking. Storage time from date of delivery is recommended not to exceed 12 months. Please consult the Material Safety Datasheet for additional information.
3. The usual precautions for handling chemicals must be observed. In particular the general threshold level for fine dust must be observed. Please consult the Material Safety Datasheet for additional information.
